Packaging of microwave integrated circuits operating beyond 100 GHz

@article{Daniel2002PackagingOM,
  title={Packaging of microwave integrated circuits operating beyond 100 GHz},
  author={Erik S. Daniel and V. Sokolov and Scott D. Sommerfeldt and J. Bublitz and Kimberly A. Olson and Barry K. Gilbert and Lorene Samoska and David H. Chow},
  journal={Proceedings. IEEE Lester Eastman Conference on High Performance Devices},
  year={2002},
  pages={374-383}
}
Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB, from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method.. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions… CONTINUE READING

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