Packaging for power semiconductors based on the 3D printing technology Selective Laser Melting

@article{Conrad2014PackagingFP,
  title={Packaging for power semiconductors based on the 3D printing technology Selective Laser Melting},
  author={Marcus Conrad and Rik. W. De Doncker and Maximilian Schniedenharn and Andrei Diatlov},
  journal={2014 16th European Conference on Power Electronics and Applications},
  year={2014},
  pages={1-7}
}
In this paper a new packaging technique based on Selective Laser Melting is presented which tries to replace solder or sinter layers, respectively bond wires. Following the intended contact geometry and concept, simulations show the influence of the contact geometry on the thermo-mechanical stress the device is committed to. First investigations on the constraints of the production process are represented. Finally the feasibility of the proposed packaging technique is shown. 

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