Packaging IGBT modules by rapid sintering of nanosilver paste in a current way

Abstract

Rapid sintering of nanosilver paste had been proposed to bond power chips in our previous work. It seems a potential good way to improve the efficiency of power module manufacturing because of the much shorter sintering time, i.e., 15 seconds. In this study, we tried the way of rapid sintering of nanosilver paste for bonding power chips in order to verify… (More)

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Cite this paper

@article{Xie2017PackagingIM, title={Packaging IGBT modules by rapid sintering of nanosilver paste in a current way}, author={Yijing Xie and Yunhui Mei and Shuangtao Feng and Pu Zhang and Long Zhang and Yingkun Yang}, journal={2017 International Conference on Electronics Packaging (ICEP)}, year={2017}, pages={112-116} }