PWB warpage analysis and verification using an AP210 standards-based engineering framework and shadow moire

@article{Zwemer2004PWBWA,
  title={PWB warpage analysis and verification using an AP210 standards-based engineering framework and shadow moire},
  author={D. Zwemer and Mohit Bajaj and Russell Peak and Trotter Thurman and Kristina A Brady and Stephen McCarron and Allan C Spradling and Matthew Dickerson and Lothar Klein and Giedrius Liutkus and John Messina},
  journal={5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the},
  year={2004},
  pages={121-131}
}
Thermally induced warpage of printed wiring boards (PWB) and printed wiring assemblies (PWAs) is an increasingly important issue in managing the manufacturing yield and reliability of electronic devices. In this paper, we introduce complementary simulation and experimental verification procedures capable of investigating warpage at the local feature level as well as the global PWB level. Simulation within a standards-based engineering framework allows efficient introduction of detailed feature… CONTINUE READING
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