PHM-based residual life computation of electronics subjected to a combination of multiple cyclic-thermal environments

Abstract

Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantification of thermal environments during use-life is often not feasible because of the data-capture and storage… (More)

Topics

21 Figures and Tables

Slides referencing similar topics