P3N-2 Packaging of SAW Devices with Small, Low Profile and Hermetic Performance

Abstract

Cellular-phone markets are moving quite aggressively towards module integration and as a result, the miniaturization of devices has been accelerated. Especially SAW filters, which are key devices in RF parts, are demanded to realize a small size, low profile, with high reliability performance. Conventional SAW filters use a HTCC package with cavity… (More)

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