Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder

Abstract

Concentrations of 0.1. 0.3. and 0.5 wt.% of Cr were added to Sn-3Ag-3Bi alloy to produce Sn-Ag-Bi-Cr alloys. The microstmcture is refined with Cr additions, while significantly improves the oxidation resistance. There is no change in the wettability and liquidus temperature after Cr additions. In addition, the effect of Cr addition on the intermetallic… (More)

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Cite this paper

@article{Wang2007OxidationBA, title={Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder}, author={Huan Wang and Anmin Hu and Chengkang Chang Ming Li and Dali Mao}, journal={2007 8th International Conference on Electronic Packaging Technology}, year={2007}, pages={1-4} }