Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

@article{Wu2010OverviewOP,
  title={Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation},
  author={Tzong-Lin Wu and H. Y. Chuang and Ting-Kuang Wang},
  journal={IEEE Transactions on Electromagnetic Compatibility},
  year={2010},
  volume={52},
  pages={346-356}
}
Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first… CONTINUE READING
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