Optimum design methodology for thermally stable multi-finger power SiGe HBTs

@article{Jin2010OptimumDM,
  title={Optimum design methodology for thermally stable multi-finger power SiGe HBTs},
  author={Dong-yue Jin and Wanrong Zhang and B. Fazenda Fengshou Gu Andrew Ball Luyang Guan and Liankun Chen and Ning Hu and Ying Xiao and Ren-Qing Wang},
  journal={2010 International Workshop on Junction Technology Extended Abstracts},
  year={2010},
  pages={1-4}
}
The two-dimensional temperature profile of a multi-finger power SiGe HBT is studied with the electrothermal model, which shows that there is an uneven temperature profile over the device finger for HBT with uniform finger length. Because of the positive current-temperature feedback, the uneven temperature profile will leads to an anomalous current distribution, which eventually caused the thermal instability. To improve the uneven temperature profile and enhance the thermal stability, the HBT… CONTINUE READING