Optimization of underfill material for better reliability and thermal behavior of 3D packages with TSVs

@article{Kim2013OptimizationOU,
  title={Optimization of underfill material for better reliability and thermal behavior of 3D packages with TSVs},
  author={Yeonsung Kim and S. B. Park},
  journal={2013 IEEE 63rd Electronic Components and Technology Conference},
  year={2013},
  pages={2310-2318}
}
The demands for a high-density, high-speed, and smaller integrated circuit have resulted in 3D stacked packages with through-silicon via (TSV) technology. Due to their sophisticated structure and complex manufacturing process, however, many issues related to the reliability and thermal management of these 3D packages are still under investigation. Failure at the solder joints between the chip and substrate is inevitable when the 3D package is exposed to thermal loading. The discrepancy in the… CONTINUE READING