Optimization of 2 Mil Al Wire Wedge Bond of D-PAK


Wire bonding is the most critical process in package assembly manufacturing. Among the wire bond-related failure mechanisms wedge bond heel crack is quite common and critical in the semiconductor industry. This paper focuses on enhancing the robustness of Al wire wedge bond heel in D-PAK under the reliability test of temperature cycling. The Al wire wedge… (More)


16 Figures and Tables