Optimization methods for post-bond die-internal/external testing in 3D stacked ICs

@article{Noia2010OptimizationMF,
  title={Optimization methods for post-bond die-internal/external testing in 3D stacked ICs},
  author={Brandon Noia and Krishnendu Chakrabarty and Erik Jan Marinissen},
  journal={2010 IEEE International Test Conference},
  year={2010},
  pages={1-9}
}
Testing of three-dimensional (3D) stacked ICs (SICs) is starting to receive considerable attention in the semiconductor industry. Since the die-stacking steps of thinning, alignment, and bonding can introduce defects, there is a need to test multiple subsequent partial stacks during 3D assembly. We address the problem of test-architecture optimization for 3D stacked ICs to minimize overall test time when either the complete stack only, or the complete stack and multiple partial stacks, need to… CONTINUE READING
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