Optimization for Multiple Patterning Lithography with cutting process and beyond

@article{Kuang2016OptimizationFM,
  title={Optimization for Multiple Patterning Lithography with cutting process and beyond},
  author={Jian Kuang and Evangeline F. Y. Young},
  journal={2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)},
  year={2016},
  pages={43-48}
}
Multiple Patterning Lithography (MPL) is indispensable for producing sub-22nm devices. Recently, multiple patterning with cutting (MPC) was proposed. For example, in triple patterning with cutting (LELECUT), the first two masks are used to do double patterning, whereas the third mask is used to cut off the unwanted parts. In this paper, we will… CONTINUE READING