Optical and Electrical Testing of Latchup in I/O Interface Circuits

Abstract

Backside light emission and electrical measurements were used to evaluate the susceptibility to latchup of externally cabled I/O pins for a 0.13 μm technology generation [1,2] test chip, which was designed in a flip-chip package. Case studies of several Inputs/Outputs (I/Os) are shown along with conclusions regarding layout and floorplanning to ensure the… (More)
DOI: 10.1109/TEST.2003.1270845

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Cite this paper

@inproceedings{Stellari2003OpticalAE, title={Optical and Electrical Testing of Latchup in I/O Interface Circuits}, author={Franco Stellari and Peilin Song and Moyra K. McManus and Robert Gauthier and Alan J. Weger and Kiran V. Chatty and Mujahid Muhammad and Pia Sanda}, booktitle={ITC}, year={2003} }