Optical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding TiO2/Silicone Encapsulation Layer

@article{Zheng2014OpticalPE,
  title={Optical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding TiO2/Silicone Encapsulation Layer},
  author={Huai Zheng and Lan Li and Xiang Jie Lei and Xingjian Yu and Sheng Liu and Xiaobing Luo},
  journal={IEEE Electron Device Letters},
  year={2014},
  volume={35},
  pages={1046-1048}
}
Owing to the strong light scattering effect of TiO2 nanoparticle and silicone composite, a method for improving optical performances of chip-on-board (COB) packaging LEDs was proposed through introducing a thin auxiliary encapsulation layer with high-concentration TiO2 nanoparticle and silicone composite below the main encapsulation layer. Its optical performance enhancement effect was examined by experiments. Results show that for the main encapsulation layer only consisting silicone, the… CONTINUE READING
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LED Packaging for Lighting Applications: Design, Manufacturing and Testing

S. Liu, X. Luo
Hoboken, NJ, USA: Wiley, • 2011
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