Opportunities and challenges of 3D NAND scaling

@article{Goda2013OpportunitiesAC,
  title={Opportunities and challenges of 3D NAND scaling},
  author={Akira Goda},
  journal={2013 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)},
  year={2013},
  pages={1-2}
}
  • Akira Goda
  • Published 2013 in
    2013 International Symposium on VLSI Technology…
3D NAND is attracting increasing attention as a NAND scaling solution. In 3D NAND, the physical cell size is decoupled from the effective cell size by stacking multiple tiers. This enables effective NAND cell size scaling without degrading cell performance and reliability. However, 3D process integration could introduce new sources of cell degradation. This paper will discuss the opportunities and challenges of 3D NAND scaling.