On the parametric failures of SRAM in a 3D-die stack considering tier-to-tier supply cross-talk

@article{Yueh2012OnTP,
  title={On the parametric failures of SRAM in a 3D-die stack considering tier-to-tier supply cross-talk},
  author={Wen Yueh and Subho Chatterjee and Amit Ranjan Trivedi and Saibal Mukhopadhyay},
  journal={2012 IEEE 30th VLSI Test Symposium (VTS)},
  year={2012},
  pages={264-269}
}
This paper analyzes the supply crosstalk between logic cores and SRAMs on separate tiers in a 3D die-stack using a distributed RLC based 3D power grid model. The analysis shows that due to the supply cross-talk power variation in cores modulates the performances and parametric failures in SRAM.