On the charging and thermal characterization of a micro/nano structured thermal ground plane

@article{Bock2010OnTC,
  title={On the charging and thermal characterization of a micro/nano structured thermal ground plane},
  author={H. Peter J. de Bock and Shakti Chauhan and Pramod Chamarthy and Stanton E. Weaver and T. Deng and Frank M. Gerner and Mohammed T. Ababneh and Kripa K Varanasi},
  journal={2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems},
  year={2010},
  pages={1-6}
}
As power densities in electronic devices have increased dramatically over the last decade, advanced thermal management solutions are required. A significant part of the thermal resistance budget is commonly taken up by the heat spreader, which serves to reduce the input heat flux and connect to an increased area for heat removal. Thermal ground planes are… CONTINUE READING