On effective flip-chip routing via pseudo single redistribution layer

@article{Hsu2012OnEF,
  title={On effective flip-chip routing via pseudo single redistribution layer},
  author={Hsin-Wu Hsu and Meng-Ling Chen and Hung-Ming Chen and Hung-Chun Li and Shi-Hao Chen},
  journal={2012 Design, Automation & Test in Europe Conference & Exhibition (DATE)},
  year={2012},
  pages={1597-1602}
}
Due to the advantage of flip-chip design in power distribution but controversial peripheral IO placement in lower design cost, redistribution layer (RDL) is usually used for such interconnection. Sometimes RDL is so congested that the capacity for routing is insufficient. Routing therefore cannot be completed within a single layer even for manual routing. Although [2] proposed a routing algorithm that uses two layers of RDLs, but in practice the required routing area is a little more than one… CONTINUE READING

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Key Quantitative Results

  • With the heuristics for routing on mapped channels and observations on staggered pins to relieve vertical constraints, the area of 2-layer routing can be minimized and the routability is 100%.
  • With the heuristics for routing on mapped channels and observations on staggered pins to relieve vertical constraints, the area of 2-layer routing can be minimized and the routability is 100%.
  • Our approaches can achieve 100% routability and minimize the area for 2-layer routing on a real industrial case.

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