On-chip interconnects for next generation system-on-chips

@article{Brinkmann2002OnchipIF,
  title={On-chip interconnects for next generation system-on-chips},
  author={A. Brinkmann and J. Niemann and I. Hehemann and D. Langen and Mario Porrmann and U. Ruckert},
  journal={15th Annual IEEE International ASIC/SOC Conference},
  year={2002},
  pages={211-215}
}
  • A. Brinkmann, J. Niemann, +3 authors U. Ruckert
  • Published 2002
  • Computer Science
  • 15th Annual IEEE International ASIC/SOC Conference
  • Today's deep submicron fabrication technologies enable design engineers to put an impressive number of components like microprocessors, memories, and interfaces on a single microchip. With the emergence of 100 nm processes, billions of transistors can be integrated on one die and form a parallel system, consisting of thousands of components. To handle this impressive number of components, it is important to provide a communication infrastructure which is able to scale with the capabilities of… CONTINUE READING
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