Observer based junction temperature estimator in thermoelectrical aging

@article{Ginart2010ObserverBJ,
  title={Observer based junction temperature estimator in thermoelectrical aging},
  author={Antonio Ginart and Irfan N. Ali and Irtaza Barlas and Patrick W. Kalgren and Michael J. Roemer and Kai F. Goebel},
  journal={2010 IEEE Aerospace Conference},
  year={2010},
  pages={1-9}
}
  • Antonio Ginart, Irfan N. Ali, +3 authors Kai F. Goebel
  • Published in IEEE Aerospace Conference 2010
  • Engineering
  • Transistor thermal model is nonlinear and highly dependent upon temperature. For reliability assessments, accurate estimation of the junction temperature is especially critical. This paper proposes a novel approach that employs an observer during thermoelectrical aging for estimation of the junction temperature based on available and measurable temperature data. 1 2 

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    SHOWING 1-7 OF 7 REFERENCES

    Katsis “ Thermal Characterization of DieAttach Degradation in the Power MOSFET ”

    • S. Clemente, B. R. Pelly, A. Isidori
    • PhD thesis Virginia Polytechnic Institute
    • 2003

    Void induced thermal impedance in power semiconductor modules: some transient temperature effects

    • D.C. Katsis, J.D. van Wyk
    • Engineering
    • Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248)
    • 2001
    VIEW 1 EXCERPT

    Reliability of Solder Die Attaches for High Power Application

    • P. Srinivasan
    • Master’s Thesis, Dept. Mech. Eng., Univ. Maryland, College Park, MD, 2000.
    • 2000
    VIEW 1 EXCERPT

    Thermal reliability of power insulated gate bipolar transistor (IGBT) modules

    • Wuchen Wu, Guo Gao, +4 authors P. Scacco
    • Engineering
    • Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings
    • 1996
    VIEW 1 EXCERPT