Observation and analysis of metal oxide reduction by formic acid for soldering

@article{Ozawa2016ObservationAA,
  title={Observation and analysis of metal oxide reduction by formic acid for soldering},
  author={Naoto Ozawa and Tatsuo Okubo and Jun Matsuda and Tatsuo Sakai},
  journal={2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)},
  year={2016},
  pages={148-151}
}
  • Naoto OzawaT. Okubo T. Sakai
  • Published 1 October 2016
  • Materials Science
  • 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
A method to observe oxide layer states with an ellipsometer in real-time and the relationship between solder wettability and remaining oxide layer thickness are reported in this paper. An experiment system is constructed with a spectrum ellipsometer and a vacuum chamber which has a port to introduce formic acid gas to observe the copper oxide layer reduction process by formic acid in real-time. The oxide layer thickness is monitored with the system, and solder wettability is evaluated by… 

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References

SHOWING 1-9 OF 9 REFERENCES

Study of fluxless soldering using formic acid vapor

This paper presents a systematic study of the use of formic acid vapor fluxless soldering with eutectic Pb/Sn solder. The study focused on the solder joint self-aligning process and the final

Thermal impact of solder voids in the electronic packaging of power devices

  • N. Zhu
  • Engineering
    Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)
  • 1999
The subject of this paper is the thermal impact of solder voids in the electronic packaging of semiconductor power devices. First, the pros and cons of some conventional methods used in thermal

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

The drive for Pb-free solders in the microelectronics industry presents several new reliability challenges. Examples include package compatibility with higher process temperatures, new solder

Application of Low Temperature Dry Cleaning Technology with Formic Acid to Cu/Low-k Wiring Process

  • Clean Technology, vol. 16, No.4, pp. 31-33, 2006. (in Japanese)
  • 2006

Development of the System for Cu Oxide Film Removal from Semiconductor Interconnections in Atmosphere Pressure

  • Ebara Engineering Report, No.218, pp.40-44, 2008. (in Japanese)
  • 2008

Power Semiconductor Market 2015 to 2016

  • (in Japanese)

Copper Direct Joint by Formic Acid with Platinum Catalyst

  • Proc. MES-2013, 2013, p.277. (in Japanese)
  • 2013

Research on Reaction of Copper Reduction by Formic Acid Application of Low Temperature Dry Cleaning Technology with Formic Acid to Cu / Lowk Wiring Process

  • Clean Technology
  • 2006

Research on Reaction of Copper Reduction by Formic Acid

  • Proc. 30th Japanese Institute of Electronics Packaging Spring Meeting, 2016, pp.314-315. (in Japanese)
  • 2016