Numerical simulations of thermo-mechanical stresses during the casting of multi-crystalline silicon ingots

@article{Oswald2010NumericalSO,
  title={Numerical simulations of thermo-mechanical stresses during the casting of multi-crystalline silicon ingots},
  author={Marcus Oswald and Marko Turek and J{\"o}rg Bagdahn},
  journal={2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)},
  year={2010},
  pages={1-5}
}
Silicon is an important semiconductor substrate for manufacturing solar cells. The mechanical and electrical properties of multi-crystalline silicon (mc-Si) are primarily influenced by the quality of the feedstock material and the crystallization process. In this work, numerical calculations, applying finite element analysis (FEA) and finite volume methods (FVM) are presented, in order to predict thermo-mechanical stresses during the solidification of industrial size mc-Si ingots. A two… CONTINUE READING