Numerical simulation on heat pipe for high power LED multi-chip module packaging

@article{Li2009NumericalSO,
  title={Numerical simulation on heat pipe for high power LED multi-chip module packaging},
  author={Dongmei Li and G. Q. Zhang and Kailin Pan and Xiaosong Ma and Lei Liu and Jinxue Cao},
  journal={2009 International Conference on Electronic Packaging Technology & High Density Packaging},
  year={2009},
  pages={393-397}
}
Light emitting diode (LED) as the new light source has the advantages of power saving, environment-friendly, long lifetime and no pollution compared with fluorescent and incandescent lights. But the disadvantage of LED is low light lumen that only 10%~20% input power transform into the light, and 80%~90% into the heat. The junction temperature of LED is so high as to induce the lifetime declining rapidly, luminous decay and reliability decreasing. Therefore, the effective thermal management is… CONTINUE READING
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