Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

@inproceedings{Sadasiva2012NumericalSO,
  title={Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects},
  author={Subramanya Sadasiva and Ganesh Subbarayan and Lei Jiang and Daniel Pantuso},
  year={2012}
}
Understanding the effect of high current density on void formation and growth and relating the size of the void to the resulting electrical/mechanical failure is a critical need at the present time to ensure reliable functioning of flip-chip packages. In general, toward this end, the modeling and simulation of geometrical evolution of current induced voids have been relatively few. Simulations considering the coupled effects of mass transport through mechanisms of surface and bulk diffusion… CONTINUE READING

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