## Ch flow and heat tra neering , vol . 27 , Garimella , “ An of microchanne thods in Heat an Y . Kim , “ Shape o nic cooling , ” IE chnologies , vol . . Y . Kim , “ Therm ezoidal cross - sec

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This study presents the numerical simulation of three-dimensional incompressible steady and laminar fluid flow and conjugate heat transfer of a trapezoidal microchannel heat sink using water as a cooling fluid in a silicon substrate. Navier-Stokes equations with conjugate energy equation are discretized by finite-volume method. We perform numerical… (More)

- Heat sink
- Numerical analysis
- Response surface methodology
- Genetic algorithm
- Heat Sink Device Component
- Mathematical optimization
- Pumping (computer systems)
- Program optimization
- Thermal resistance
- pump (device)
- Finite volume method
- Algorithm
- Navier–Stokes equations
- Computer simulation
- Discretization
- Simulation
- Computation
- Wafer (electronics)
- Reynolds-averaged Navier–Stokes equations
- Computer cooling
- Silicon
- algorithm