Numerical Modeling for the Underfill Flow in Flip-Chip Packaging

  title={Numerical Modeling for the Underfill Flow in Flip-Chip Packaging},
  author={J. W. Wan and W. Zhang and D. J. Bergstrom},
  journal={IEEE Transactions on Components and Packaging Technologies},
In the prediction of underfill flow in a flip-chip package, numerical methods are usually used for flow analysis and simulation since analytical methods cannot meet the requirement for predicting fluid distribution in a planar analysis. At present, there appears to be no simulation software commercially available that is able to provide adequate prediction for the underfill flow process driven by capillary force in a micro-cavity situation. In the study presented in this paper, a numerical… CONTINUE READING
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