Numerical Examination and Experimental Verification of Thermal Performance of Board-level QFP with Unattached Drop-in Heat Spreader

Abstract

In this paper, we evaluate the board-level thermal performance of QFP with an unattached drop-in heat spreader numerically and experimentally. The die is given a power dissipation and induced thermomechanical deformations and the gap distribution on the unattached interface are calculated through the three-dimensional thermal-mechanical coupling analysis incorporated with the contact methodology. The measured junction to ambient thermal resistance is used to validate the numerical results, which involve different interfacial thermal transfer conditions

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Cite this paper

@article{Lai2006NumericalEA, title={Numerical Examination and Experimental Verification of Thermal Performance of Board-level QFP with Unattached Drop-in Heat Spreader}, author={Yi-Shao Lai and Tong Hong Wang and Chang-Chi Lee and Hsuan-Yu Chen}, journal={EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems}, year={2006}, pages={1-6} }