Numerical Analysis of the Influence of Polymeric Materials on a MEMS Package Performance Under Humidity and Temperature Loads

@article{Yalagach2019NumericalAO,
  title={Numerical Analysis of the Influence of Polymeric Materials on a MEMS Package Performance Under Humidity and Temperature Loads},
  author={Mahesh Yalagach and Peter Filipp Fuchs and Archim Wolfberger and Mario Gschwandl and Thomas Antretter and Michael Feuchter and Coen Tak and Qi Tao},
  journal={2019 IEEE 69th Electronic Components and Technology Conference (ECTC)},
  year={2019},
  pages={2029-2035}
}
  • Mahesh Yalagach, Peter Filipp Fuchs, +5 authors Qi Tao
  • Published in
    IEEE 69th Electronic Components and Technology…
    2019
  • DOI:10.1109/ECTC.2019.00311
The rapid expansion of the Internet of Things (IoT) and consumer electronics is driving the demand for microelectromechanical systems (MEMS) in the area of wearables, smartphones, and home and building applications. MEMS sensor packages feature a variety of polymeric materials which can significantly affect their behavior under environmental loads as humidity or temperature. A broad range of different polymeric materials can be applied in the packages, but to get a good MEMS sensor performance… CONTINUE READING

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