Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors

@article{Tanikawa2015NovelLS,
  title={Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors},
  author={Seiya Tanikawa and Hisashi Kino and Takafumi Fukushima and Mitsumasa Koyanagi and Tetsu Tanaka},
  journal={2015 International 3D Systems Integration Conference (3DIC)},
  year={2015},
  pages={TS3.1.1-TS3.1.4}
}
Three-dimensional integrated circuit (3D IC) is one of the promising ways to enhance IC performance. Each IC chip is mechanically connected by organic adhesive and metal microbumps. Coefficient of thermal expansion (CTE) mismatch between materials causes local bending stress in IC chips, leading to negative effects in IC performance. In this study, we have fabricated a test structure with DRAM cell array having planar MOS capacitors. Using the test structure, we measured both DRAM chip bending… CONTINUE READING
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Showing 1-9 of 9 references

1

  • M. Motoyoshi, K Yanagimura
  • Takanohashi, M. Murugesan, M. Aoyagi, M. Koyanagi…
  • 2015
1 Excerpt

Measurement of local residual stress between fine metallic bumps in 3D flip chip structures

  • K Nakahira, H. Tago, T. Sasaki, K Suzuki, H. Miura
  • " International Journal of Materials and…
  • 2014

K Kiyoyama

  • K-W. Lee, Y. Ohara
  • J.-c. Bea, M. Murugesan, T. Fukushima, T. Tanaka…
  • 2013
1 Excerpt

Wafer Thinning

  • M. Murugesan, H. Kino, +8 authors M. Koyanagi
  • Bonding, and Interconnects Induced Local Strain…
  • 2010

Properties of Low-k Copper Barrier SiOCH Film Deposited by PECVD Using Hexamethyldisiloxane and N20

  • T. Ishimaru, Y. Shioya, +5 authors K Maeda
  • Journal of The Electrochemical Society,
  • 2003
1 Excerpt

Flip-Chip Solder Bump Fatigue Life Enhanced By Polymer Encapsulation

  • D. Suryanarayana, R. Hsiao, T. P. Gall, J. M. McCreary
  • " IEEE Electronic Components and Technology…
  • 1990
1 Excerpt

Young's Modulus

  • J. J. Wortman, R. A. Evans
  • Shear Modulus, and Poisson's Ratio in Silicon and…
  • 1965
1 Excerpt

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