Novel liquid phase sintered solders with indium as minority phase for next generation thermal interface material applications

@article{Kumar2008NovelLP,
  title={Novel liquid phase sintered solders with indium as minority phase for next generation thermal interface material applications},
  author={Prince Kumar and Indranath Dutta and Rajendran Raj and Mukul Prabhakar Renavikar and Vijay S. Wakharkar},
  journal={2008 Second International Conference on Thermal Issues in Emerging Technologies},
  year={2008},
  pages={325-332}
}
Because of their very high thermal conductivity, low melting point, and high shear compliance, indium-based materials are excellent candidates for thermal interface material (TIM) applications for packaging thermally sensitive next-generation devices. However, currently used indium-based solders suffer from 2 serious shortcomings: (i) high cost due to high indium content, and (ii) very low compressive strength and creep resistance which may lead to structural instability following heat-sink… CONTINUE READING