Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design

An equivalent circuit model to characterize the crosstalk strength in multiple TSVs is newly proposed. In this model, all the values of lumped elements in the model are given in closed-form formulas. Therefore, the computation effort for constructing the model of multiple TSVs is much lower than other previous works. The accuracy is verified by the… CONTINUE READING