Novel WO3 nanoparticles modified electroless metallization to retard interfacial reaction and reinforce the reliability of solder interconnection


The role of under bump metallization becomes more important to control the sharp interfacial reaction. In the study, a Ni-P-WO3 composite layer was developed as a novel UBM for solder interconnection. It's the first time tungsten oxide nanoparticles been used in solder metallization to reinforce the joint. After surface treatment, magnetic stirring and… (More)


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