Nonlinear Dynamics Modeling of Correlated Functional Process Variables for Condition Monitoring in Chemical–Mechanical Planarization

  • Hui Wang, Xi Zhang, Anurag Kumar, Qiang Huang
  • Published 2009 in IEEE Transactions on Semiconductor Manufacturing

Abstract

This paper aims to investigate correlation mechanism among functional process variables (FPVs) for condition monitoring in chemical-mechanical planarization (CMP). During wafer polishing, critical process variables such as coefficient of friction and pad temperature vary with time and present in the shape of functional curves. Our previous work has… (More)

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