Nondestructive Evaluation of Poor-Wetted Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique

Abstract

A laser ultrasound and interferometer inspection system has been successfully applied to detect solder bump defects, including missing, misaligned, open, and cracked solder bumps in flip chips, land grid array packages and chip capacitors. This system uses a pulsed Nd:YAG laser to induce ultrasound in the chip packages in the thermoelastic regime; it then… (More)

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