Noncontact wafer probe using wireless probe cards

  title={Noncontact wafer probe using wireless probe cards},
  author={Chris Sellathamby and Md. Mahbub Reja and Lin Fu and Brenda Bai and Edwin Walter Reid and Steven Slupsky and Igor M. Filanovsky and Krzysztof Iniewski},
  journal={IEEE International Conference on Test, 2005.},
  pages={6 pp.-452}
A method for wireless, noncontact testing of semiconductor wafers is presented. The technology applies to chips with active electronics, including standard integrated circuits (ICs), which require testing at the wafer level. The technology relies on short-range, near field communications to transfer data at gigabit per second rates between the probe card and the device under test (DUT) on a wafer. The probe consists of a CMOS device with micro antenna structures and transceiver circuits. Each… CONTINUE READING
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