Non-metallic Bonding Tool Technique; A Key Input Control for Contamination in Ultrasonic Wirebonding Process


In the search for total solution to reduce wedge tool rate of Aluminum debris build-up in Ultrasonic wire bonding for semiconductor manufacturing, several approaches and techniques were introduced but results differ from each other. The approach taken is composite material selection. Tungsten Carbide wedge tool has been the most established material for… (More)


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