Noise and Interference Management in 3-D Integrated Wireless Systems

Abstract

Three-dimensional (3-D) integration technology is an emerging candidate to alleviate the interconnect bottleneck by utilizing the third dimension. One of the important advantages of the 3-D technology is the capability to stack memory on top of the processor cores, significantly increasing the memory bandwidth. The application of 3-D integration to high… (More)

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Cite this paper

@inproceedings{Salman2010NoiseAI, title={Noise and Interference Management in 3-D Integrated Wireless Systems}, author={Emre Salman and Alex Doboli and Milutin Stanacevic}, year={2010} }