New millimeter wave packaged antenna array on IPD technology

@article{Calvez2010NewMW,
  title={New millimeter wave packaged antenna array on IPD technology},
  author={Christophe Calvez and Christian Person and J. P. Coupez and François Gall{\'e}e and Hilal Ezzeddine and Andreia Cathelin and Didier Belot},
  journal={2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)},
  year={2010},
  pages={96-99}
}
In the millimeter wave (mmWave) frequency range, the recent advances in CMOS and BiCMOS technologies make possible the integration of entire RF front-ends on the same chip (System on Chip (SoC) approach). The present challenge concerns the antenna integration within the packaging (System in Package (SiP) approach) which will support the complete analog and digital system. Integrated antennas on silicon cannot exhibit gain performances greater than 7 dBi, typically, (14 dBi as currently expected… CONTINUE READING

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