New 3D integration technology and 3D system LSIs

  title={New 3D integration technology and 3D system LSIs},
  author={Mitsumasa Koyanagi},
  journal={2009 Symposium on VLSI Technology},
A three-dimensional (3-D) integration technology based on the wafer-to-wafer bonding has been developed. Various kinds of 3-D LSI test chips such as 3-D microprocessor chip have been fabricated by using this technology. In addition, we have developed a new 3-D integration technology called super-chip integration based on the reconfigured wafer- to-wafer bonding in which the reconfigured wafers are produced by simultaneously aligning and bonding more than one thousand of known good dies (KGD's… CONTINUE READING

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