Nanoscale deformation measurement of microscale interconnection assemblies by a digital image correlation technique.

Abstract

The continuous miniaturization of microelectronic devices and interconnections demand more and more experimental strain/stress analysis of micro- and nanoscale components for material characterization and structure reliability analysis. The digital image correlation (DIC) technique, with the aid of scanning probe microscopes, has become a very promising… (More)
DOI: 10.1088/0957-4484/18/39/395504

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