Nanoindentation on SnAgCu lead-free solder and analysis

Abstract

To improve the measurement accuracy of hardness and modulus results of lead-free SnAgCu from nanoindentation experiments, evaluation of the creep effect on measured result and was reported. For SnAgCu solder in this study, it was found that penetration continues with a very long time and the penetration depth could increase extra 1000 nm when the load was… (More)

8 Figures and Tables

Cite this paper

@article{Xu2005NanoindentationOS, title={Nanoindentation on SnAgCu lead-free solder and analysis}, author={Luhua Xu and J.H.L. Pang}, journal={2005 7th Electronic Packaging Technology Conference}, year={2005}, volume={1}, pages={4 pp.-} }