Nanoindentation of Au and Pt / Cu thin films at elevated temperatures

  title={Nanoindentation of Au and Pt / Cu thin films at elevated temperatures},
  author={Alex A. Volinskya and N. Moody and William W. Gerberich},
This paper describes the nanoindentation technique for measuring sputter-deposited Au and Cu thin films’ mechanical properties at elevated temperatures up to 130 °C. A thin, 5-nm Pt layer was deposited onto the Cu film to prevent its oxidation during testing. Nanoindentation was then used to measure elastic modulus and hardness as a function of temperature. These tests showed that elastic modulus and hardness decreased as the test temperature increased from 20 to 130 °C. Cu films exhibited… CONTINUE READING
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