Nano size cerium hydroxide slurry for scratch-free CMP process

Abstract

We report recent progress in a novel cerium hydroxide polishing slurry with particle size of about 5 nm nano size cerium hydroxide (NSC) abrasive. NSC has succeeded in omitting particles over 1 μm, and in reducing scratches to 1/30 of those with calcined ceria slurry. Even though, NSC maintains oxide removal rate similar to conventional ceria. Mixing NSC… (More)

7 Figures and Tables

Topics

  • Presentations referencing similar topics