Nano nickel-tin interconnects and electrodes for next generation 15 micron pitch embedded bio fluidic sensors in FR4 substrates

  • Ravi Doraiswami
  • Published 2006 in
    56th Electronic Components and Technology…
Lead free solder bumping requirements have challenged researchers to develop technologies to achieve fine pitch interconnects. ITRS has predicts that by 2017 the industry require 70 micron pitch area array lead free interconnects for flip chips. This paper describes bumping, assembly and reliability evaluation of a nano composite 15 micron pitch… CONTINUE READING