Nano-Scale Conductive Films with Low Temperature Sintering for High Performance Fine Pitch Interconnect

@article{Li2007NanoScaleCF,
  title={Nano-Scale Conductive Films with Low Temperature Sintering for High Performance Fine Pitch Interconnect},
  author={Yi Li and M. J. Yim and Kyung Sik Moon and C. P. Wong},
  journal={2007 Proceedings 57th Electronic Components and Technology Conference},
  year={2007},
  pages={1350-1355}
}
In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of… CONTINUE READING