Multiphysics Simulation of 3-D ICs With Integrated Microchannel Cooling

@article{Lu2016MultiphysicsSO,
  title={Multiphysics Simulation of 3-D ICs With Integrated Microchannel Cooling},
  author={Tianjian Lu and Feini Zhang and Jian-Ming Jin},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2016},
  volume={6},
  pages={1620-1629}
}
A multiphysics-based co-simulation technique is developed based on the finite element method for the characterization of 3-D high-frequency integrated circuits (ICs) with integrated microchannel cooling. The multiphysics in the co-simulation includes full-wave electromagnetic, fluid, and transient conjugate heat transfer analyses. For incompressible and fully developed flows, the governing equations of fluid flow are decoupled from temperature, and the velocity field is obtained analytically… CONTINUE READING

Citations

Publications citing this paper.
SHOWING 1-9 OF 9 CITATIONS

Multiphysics Modeling in Electromagnetics: Technical Challenges and Potential Solutions

VIEW 3 EXCERPTS
CITES BACKGROUND

Flexible and Accurate Simulation of Radiation Cooling with FETD Method

VIEW 3 EXCERPTS
CITES BACKGROUND
HIGHLY INFLUENCED

Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

VIEW 3 EXCERPTS
CITES BACKGROUND & METHODS

Modeling and Analysis for MOS Capacitance of TSV Considering Temperature Dependence

  • Qiu Min, Erping Li, Jian-Ming Jin
  • Engineering
  • 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)
  • 2019
VIEW 1 EXCERPT
CITES BACKGROUND

Multiphysics Modeling of Voice Coil Actuators With Recurrent Neural Network

VIEW 1 EXCERPT
CITES METHODS

Electrical-Thermal Characterizations of SIW with Numerical SOC Technique

VIEW 1 EXCERPT
CITES BACKGROUND

Modeling Voice Coil Actuators with Recurrent Neural Network

VIEW 1 EXCERPT
CITES METHODS

Electrothermal co-simulation of a two-chip power delivery network in frequency domain

VIEW 2 EXCERPTS
CITES BACKGROUND

Simulation of radiative cooling with FETD method

VIEW 1 EXCERPT
CITES BACKGROUND

References

Publications referenced by this paper.
SHOWING 1-10 OF 26 REFERENCES

The Finite Element Method in Electromagnetics, 3rd ed

  • J.-M. Jin
  • Hoboken, NJ, USA: Wiley,
  • 2014
VIEW 6 EXCERPTS
HIGHLY INFLUENTIAL

Electrical-Thermal Co-Simulation for Analysis of High-Power RF/Microwave Components

VIEW 3 EXCERPTS

Electrical-Thermal Co-Simulation for DC IR-Drop Analysis of Large-Scale Power Delivery

VIEW 2 EXCERPTS

Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems

VIEW 1 EXCERPT

Fast compact transient thermal modeling for 3 D ICs with intertier liquid cooling

  • J. Xie, M. Swaminathan
  • Proc . IEEE / ACM Int . Conf . Comput .Aided Design , Nov The Finite Element Method in Electromagnetics
  • 2014

Thermal-Aware High-Frequency Characterization of Large-Scale Through-Silicon-Via Structures

VIEW 2 EXCERPTS

Transient Electrical-Thermal Analysis of 3-D Power Distribution Network With FETI-Enabled Parallel Computing

VIEW 2 EXCERPTS