Multilayer MMIC for stacked integrated circuits


In the flip-chip mounting of MMIC chips, an adequate separation between the flip chip and the mounting substrate must be maintained to prevent undesirable loading effects. In this paper, as an approach to solve this restriction, an electrically shielded MMIC is presented. This can be realized employing multilayer MMIC technology. An electrically shielded… (More)

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@article{Imaoka1996MultilayerMF, title={Multilayer MMIC for stacked integrated circuits}, author={Toshikazu Imaoka and Akira Minakawa and Nobuaki Imai}, journal={1996 26th European Microwave Conference}, year={1996}, volume={2}, pages={583-587} }