Multi-scale, multi-physics analysis for device, chip, package, and board level

  • Weng Cho Chew
  • Published 2012 in
    2012 IEEE/ACM International Conference on…

Abstract

The computer integrated circuitmn (IC) is inundated with electromagnetic signals. These signals are omnipresent at the device, chip, package, and board level. The length-scales vary from nanometers to centimeters. The physics also changes significantly over these length-scales. It is clear that multi-scale, multi-physics analyses are needed to understand… (More)
DOI: 10.1145/2429384.2429487

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