Multi-project reticle floorplanning and wafer dicing

@inproceedings{Kahng2004MultiprojectRF,
  title={Multi-project reticle floorplanning and wafer dicing},
  author={Andrew B. Kahng and Ion I. Mandoiu and Qinke Wang and Xu Xu and Alex Zelikovsky},
  booktitle={ISPD},
  year={2004}
}
Multi-project Wafers (MPW) are an efficient way to share the rising costs of mask tooling between multiple prototype and low production volume designs. Packing the different die images on a multi-project reticle leads to new and highly challenging floorplanning formulations, characterized by unusual constraints and complex objective functions. In this paper we study multi-project reticle floorplanning and wafer dicing problems under the prevalent side-to-side wafer dicing technology. Our… CONTINUE READING
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